Are you an experienced packaging expert passionate about advancing the field of 
photonics and quantum applications? We are seeking a Team Lead Photonic Packaging 
Engineer to head our packaging efforts. In this hands-on leadership role, you will guide a 
small, dedicated team of engineers and oversee the complete packaging assembly of our 
single-photon detectors. You will be responsible for tackling the unique challenges of 
packaging Photonic Integrated Circuits (PICs) for operation at cryogenic temperatures (2 
Kelvin).

Key Responsibilities
• Team Leadership: Lead and mentor a hands-on packaging team (2+ engineers), 
planning workflows and ensuring efficient project execution.

• Advanced Packaging Processes: Develop and execute high-precision fiber-to-chip 
coupling strategies, focusing on maximizing coupling efficiency and stability at 
cryogenic temperatures.

• Assembly & Integration: Perform and oversee critical assembly steps including 
chip attachment and wire bonding, ensuring reliability under extreme thermal 
cycling.

• Thermal & Mechanical Design: Design submounts and packaging interfaces. You 
will specifically address thermal management challenges, calculating and mitigating 
mechanical stress caused by CTE (Coefficient of Thermal Expansion) mismatches
between chip, submount, and adhesive layers at 2K.

• Process Optimization: Transition manual packaging steps into automated processes.

• Interface with Design: Collaborate closely with the PIC design team to optimize 
Mode Size Converters and spot sizes for improved coupling tolerances.

• Strategic Sourcing: Select and qualify materials (epoxies, solders, submounts) 
suitable for cryogenic environments.